133.66ريال سعودي
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أقل سعر 133.66
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133.66ريال سعودي
Function: This flux paste is used for rework, ball or pin connection of BGA, PGA and CSP, and assembly operations, which is a necessary and useful tool for BGA reballing
Excellent Soldering Adhesion: The flux paste has excellent soldering adhesion and not easy to moisture, suitable for multi PCB reflow soldering
High Performance: The solder paste is environmentally friendly, easy to tin, no residue and high insulation resistance
Applicable: The flux soldering paste is suitable for general instruments, meters, copper, tin, iron and other metals
Application: The capacity of this flux paste is 10cc, which is generally used for sensor, wire, connecting protection tube, BGA chip, etc.